The Nan Trade Inc.High Purity Inorganic & Organic Chemicals
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Cuprous Chloride | Copper Chloride | CuCl | 98% | Pigment, Catalyst raw material |
| Cupric Chloride | Copper Chloride | CuCl2・2H2O | 97% | Pigment, Catalyst raw material |
| Cupric Chloride Anhydride | Cupric Chloride Anhydrous | CuCl2 | 98% | Pigment, Catalyst raw material |
| Cupric Ammonium Chloride | Copper Ammonium Chloride | CuCl2・2NH4Cl・2H2O | 95% | Fixing agent for dyestuff |
| Cupric Nitrate | Copper II Nitrate | Cu(NO3)2・3H2O | 99% | Catalyst,Combustion aid |
| Cupric Sulfate | Copper Sulfate | CuSO4・5H2O | 98% | Plating |
| Cuprous Cyanide | Copper Cyanide | CuCN | 99% | Plating |
| Sodium Copper Cyanide | Sodium tricyaocuprate | Na2[Cu(CN)3]・3H2O | 95% | Plating |
| Potassium Copper Cyanide | Potassium dicyanocuprate(1-) | K2[Cu(CN)3] | 95% | Plating |
| Brass Salt | - | - | - | Brass plating |
| Cupric Carbonate(basic) | Copper Carbonate(basic) | xCuCO3・yCu(OH)2・zH2O | 50-55% | Catalyst, Plating |
| Cupric Acetate | Copper Acetate | Cu(CH3COO)2・H2O | 95% | Catalyst, Dyestuff |
| Cupric Pyrophosphate | Copper Pyrophosphate | Cu2P2O7・4H2O | 99% | Plating |
| Cuprous Iodide | Copper Iodide | CuI | 99% | Heat stabilizer,Conductive material |
| Cuprous Oxide | Copper Oxide | Cu2O | 86% | Marinepaint, Pigment |
| Cupric Oxide | Copper Oxide | CuO | 98% | Glass, Ceramics |
| Cupric Bromide | Copper II Bromide | CuBr2 | 97% | Agricultural chemicals |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Stannous Chloride | Tin dichloride | SnCl2・2H2O | 98% | Plating, Antistripping agent |
| Stannous Chloride Anhydride | Tin II Chloride anhydrous | SnCl2 | 98% | Plating, Antistripping agent |
| Stannous Chloride (45%) | Tin dichloride | SnCl2・2H2O (soln.) | 45% | Plating, Catalyst raw material |
| Stannic Chloride Anhydride | Tin tetrachloride anhydrous | SnCl4 | 99% | Catalyst raw material, Electronics, Glass |
| Stannous Sulfate | Tin II Sulfate | SnSO4 | 98% | Electrolytic pigmentation, Plating |
| Stannous Pyrophosphate | Tin II pyrophosphate | Sn2P2O7 | 97% | Plating, Alloy plating |
| Sodium Stannate | Disodium tin trioxide | Na2SnO3・3H2O | 36-42% | Plating |
| Potassium Stannate | Potassium Tin Oxide | K2SnO3・3H2O | Sn:39% | Plating |
| Meta Stannic Acid | - | H2SnO3 | 95% | Pigment, Flame retardant |
| Stannous Oxide | Tin oxide | SnO | Sn2+: 86% | Pigment, Plating |
| Stannic Oxide | Tin dioxide | SnO2 | 99% | Electronics |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Nickel Chloride | Nickel chloride hexahydrate | NiCl2・6H2O | 24% | Plating, Dyestuff |
| Nickel Nitrate | Nickel nitrate hexahydrate | Ni(NO3)2・6H2O | 98% | Battery, Catalyst raw material |
| Nickel Sulfate | Nickel sulfate hexahydrate | NiSO4・6H2O | 21% | Plating, Catalyst raw material |
| Nickel Ammonium Sulfate | Ammonium Nickel Sulfate | (NH4)2Ni(SO4)2・6H2O | 95% | Plating |
| Potassium Nickel Cyanide | Dipotassium nickel(II) tetracyanide monohydrate | K2[Ni(CN)4]・H2O | 95% | Plating |
| Nickel Carbonate (basic) | Basic Nickel Carbonate | xNiCO3・yNi(OH)2・zH2O | 35-44% | Plating, Catalyst raw material |
| Nickel Acetate | Nickel diacetate tetrahydrate | Ni(CH3COO)2・4H2O | 95% | Anodized aluminum sealing |
| Nickel Sulfamate | Nickel amidosulfate | Ni(NH2SO3)2・4H2O | 96% | Plating, Electroforming |
| Nickel Sulfamate (60%),(65%) | Nickel amidosulfate | Ni(NH2SO3)2・4H2O (soln.) | 60%solution, 65%solution | Plating, Electroforming |
| Nickel Bromide (50%) | - | NiBr2・6H2O (soln.) | 50% | Plating |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Cobalt Chloride | Cobalt dichloride hexahydrate | CoCl2・6H2O | 98% | Paint, Plating |
| Cobalt Nitrate | Cobalt dinitrate hexahydrate | Co(NO3)2・6H2O | 98% | Catalyst raw material |
| Cobalt Sulfate | Cobalt sulfate heptahydrate | CoSO4・7H2O | 99% | Plating, Catalyst raw material |
| Cobalt Carbonate (basic) | Basic Cobalt Carbonate | xCoCO3・yCo(OH)2・zH2O | 43-47% | Catalyst raw material, Pigment |
| Cobalt Acetate | Cobalt Acetate tetrahydrate | Co(CH3COO)2・4H2O | 98% | Catalyst raw material |
| Cobalt Sulfamate (50%) | CobaltⅡ sulfamate tetrahydrate | Co(NH2SO3)2・4H2O (soln.) | 50% | Electroforming, Plating |
| Cobalt Bromide (70%) | Cobalt II bromide hexahydrate | CoBr2・6H2O (soln.) | 70% | Catalyst raw material |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Zinc Nitrate | Zinc dinitrate | Zn(NO3)2・6H2O | 99% | Dyestuff, Catalyst raw material |
| Zinc Cyanide | Zinc dicyanide | Zn(CN)2 | 54% | Plating |
| Zinc Acetate | Zinc Acetate dihydrate | Zn(CH3COO)2・2H2O | 98% | Catalyst raw material |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Chromium Chloride (40%) | Chromium trichloride | CrCl3 (soln.) | 40% | Dyestuff, Surface treatment |
| Chromium Nitrate (35%) (40%) | Chromium trinitrate | Cr(NO3)3 (soln.) | 35%, 40% | Catalyst raw material, Surface treatment |
| Chromium Sulfate (40%) | Chromic sulfate | Cr2(SO4)3(soln.) | 40% | Dyestuff, Surface treatment |
| Chromium Acetate | Chromium triacetate | Cr(CH3COO)3 (soln.) | 44~46% | Dyestuff |
| Chromium Phosphate | Chromic phosphate | CrPO4 (soln.) | 6.4-6.6% | Surface treatment |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Manganese Chloride | Manganous Chloride | MnCl2・4H2O | 97% | Catalyst raw material |
| Manganese Nitrate (50%) | - | Mn(NO3)2(soln.) | 50% | Catalyst raw material, Battery |
| Manganese Acetate | Manganese(II) Acetate Tetrahydrate | Mn(CH3COO)2・4H2O | 99% | Catalyst raw material |
| Manganic-Manganous Oxide* | Trimanganese tetraoxide | Mn3O4 | 97% | Electronics |
| Product Name | Alt Name | Formula | Purity | Application |
|---|---|---|---|---|
| Antimony Trichloride | Antimonous chloride | SbCl3 | 99% | Catalyst raw material, Pigment, Electronics |
| Antimony Pentachloride | Antimony V chloride | SbCl5 | 98% | Catalyst raw material |